Etching the Wafer

A photoresist is deposited onto the wafer surface creating a film-like substance to accept the patterned image. The mask is placed over the wafer and both are exposed to ultraviolet light. In this way the circuit pattern is transferred onto the wafer. The photoresist is developed, washing away the unwanted resist and leaving the exact image of the transferred pattern. Plasma (superhot gases) technology is used to etch the circuit pattern permanently into the wafer. This is one of several techniques used in the etching process. The wafer is returned to the furnace and given another coating on which to etch another circuit layer. The procedure is repeated for each circuit layer until the wafer is complete.